週次 |
日期 |
單元主題 |
第1週 |
03/02 |
課程介紹介,Two short talk: 1. Process
technology. 2. 3D IC for Mobile Application |
第2週 |
03/09 |
Trend & Technology Requirement of
Advanced Semiconductor |
第3週 |
03/16 |
教授出國參加研討會 |
第4週 |
03/23 |
Process Integration Engineering and
Qualification of Semiconductor |
第5週 |
03/30 |
Device Engineering(I)
|
第6週 |
03/31 |
Device Engineering(II) (補4/6課程) |
第7週 |
04/13 |
Device Engineering(III)
|
第8週 |
04/20 |
Advanced Lithography |
第9週 |
04/27 |
Salicide and Metal Local Interconnection |
第10週 |
05/04 |
Metalization and Low-k dielectric
|
第11週 |
05/11 |
Future Focus of Process Technology |
第12週 |
05/18 |
Midterm Examination |
第13週 |
05/25 |
Advanced Package(I)
Final Presentation(I) |
第14週 |
06/01 |
Advanced Package(II)
Final Presentation(II) |
第15週 |
06/08 |
Advanced Package(III)
Final Presentation(III) |
第16週 |
06/15 |
Advanced Package(IV)
Final Presentation(IV) |
第17週 |
06/22 |
Final Examination |
第18週 |
06/29 |
Final Presentation(VI)(VII)(VIII) |